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ATS-56011-C1-R0

Name: Advanced Thermal Solutions ATS-56011-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-56011-C1-R0
Price: 26.57 USD
Availability: InStock

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Mouser No:

984-ATS-56011-C1-R0

Mfr. No:

ATS-56011-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA ASIC Cooling Heat Sink, 2-Side Tape, T412, 57.5x57.5x12.5mm

Datasheet:

ATS-56011-C1-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-56011-C1-R0

In Stock: 86

Stock:: 86 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 86 will be subject to minimum order requirements.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$26.57	$26.57
	$23.77	$237.70
	$23.73	$474.60
	$23.62	$1,181.00
	$23.61	$2,361.00
	$23.60	$11,800.00
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Adhesive
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	2.3 C/W
Length:	57.5 mm
Width:	57.5 mm
Height:	12.5 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	HS with TAPE
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	Component

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Datasheet

ATS-56011-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.