TGP6000ULM-0.040-12-0816

Bergquist Company
951-TGP6ULM.04012816
TGP6000ULM-0.040-12-0816

Mfr.:

Description:
Thermal Interface Products GAP PAD, 6W/m-K, 8" x 16" Sheet, 0.040" Thickness, TGP6000ULM, IDH 2195666

Datasheet:
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Learn more about Bergquist Company TGP6000ULM-0.040-12-0816

In Stock: 147

Stock:
147
Can Dispatch Immediately
On Order:
16
Expected 20/02/2026
Factory Lead Time:
6
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$133.87 $133.87
$120.28 $1,202.80
$112.81 $2,820.25
$108.71 $5,435.50

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone
6 W/m-K
5 kVAC
Gray
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.016 mm
6 psi
UL 94 V-0
TGP 6000ULM
Brand: Bergquist Company
Designed for: Telecommunications, ASICs/DSPs, Consumer Electronics, Thermal Modules or Heat Sinks
Product Type: Thermal Interface Products
Size: 8 in x 16 in
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: GAP PAD
Part # Aliases: 2195666
Unit Weight: 310 g
Products found:
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Attributes selected: 0

USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

TGP 6000ULM 6W/m-K, High Performance GAP PAD®

Bergquist Company TGP 6000ULM 6W/m-K, High-Performance GAP PAD® are soft gap-filling materials for high-performance applications requiring low assembly stress. These materials offer exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. The 6000ULM series is highly conformal, even to surfaces with high roughness and/or topography, and allows for excellent interfacing and wet-out characteristics. This Bergquist Company TGP 6000ULM series features 6W/m·k thermal conductivity and operates in a -60°C to 200°C temperature range. These materials come with UL 94V-0 flammability rating.

Storage Applications

Bergquist Company Storage Applications feature advanced materials used in storage hardware to provide increased reliability, greater stability, and improved transfer rates. Every uptick in reliability and performance lowers costs while meeting increased user expectations. The thermal management materials from Bergquist Company include a broad variety of product types to meet various application needs.

Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

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