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KP215F1701

Name: Infineon KP215F1701
Brand: Infineon Technologies
SKU: 726-KP215F1701
Price: 4.85 USD
Availability: InStock

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Mouser No:

726-KP215F1701

Mfr. No:

KP215F1701

Mfr.:

Infineon Technologies

Description:

Board Mount Pressure Sensors Analog Absolute Pressure Sensor

Datasheet:

KP215F1701 Datasheet (PDF)

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Learn more about Infineon Technologies KP215F1701

In Stock: 1,742

Stock:: 1,742 Can Dispatch Immediately

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Factory Lead Time:: 18 Weeks Estimated factory production time for quantities greater than shown.

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Packaging:

Full Reel (Order in multiples of 1500)

Cut Tape

MouseReel™ (+$7.00)

Pricing (USD)

Qty.	Unit Price	Ext. Price
Cut Tape / MouseReel™ ^†
	$4.85	$4.85
	$4.09	$20.45
	$3.80	$38.00
	$3.45	$86.25
	$3.20	$160.00
	$2.98	$298.00
	$2.55	$1,275.00
	$2.47	$2,470.00
Full Reel (Order in multiples of 1500)
	$2.35	$3,525.00

† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Alternative Packaging

Mfr. Part No.:

KP215F1701XTMA1

Packaging:

Reel, Cut Tape

Availability:

In Stock

Price:

$4.27

Min:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Board Mount Pressure Sensors
RoHS:
Pressure Type:	Absolute
Operating Pressure:	10 kPa to 115 kPa
Accuracy:	1.4 kPa
Output Type:	Analog
Mounting Style:	SMD/SMT
Operating Supply Voltage:	5 V
Port Type:	No Port
Package/Case:	DSOF-8
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 140 C
Qualification:	AEC-Q100
Series:	KP215F1701
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	Infineon Technologies
Operating Supply Current:	8 mA
Output Voltage:	100 mV to 4.85 V
Product Type:	Board Mount Pressure Sensors
Factory Pack Quantity:	1500
Subcategory:	Sensors
Supply Voltage - Max:	5.5 V
Supply Voltage - Min:	4.5 V
Part # Aliases:	SP000698278 KP215F171XT KP215F1701XTMA1
Unit Weight:	226 mg

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Datasheet

KP215F1701 Datasheet (PDF)

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CNHTS:: 8542391000
CAHTS:: 9026200010
USHTS:: 8542390090
JPHTS:: 854239099
TARIC:: 8542399000
MXHTS:: 8542399901
ECCN:: 3A991.a.2

XENSIV™ Pressure Sensors

Infineon XENSIV™ Pressure Sensors use unique multiple surface micro-machined capacitive sensor cell arrays. These arrays support powerful self-diagnosis features like mechanical and electrical verification of sensor functionality. Monolithic integration onto a single chip enables state-of-the-art production using a standard automotive-qualified BiCMOS process. The XENSIV™ Pressure Sensors offer the lowest power consumption and best-in-class pressure resolution (down to +/- 2cm) in combination with robustness against water (IPx8), dust and humidity (DPS368), and highly accurate absolute temperature sensing (DPS422).

Manifold Air Pressure (MAP) Sensors

Infineon Technologies Manifold Air Pressure (MAP) Sensors are based on the capacitive principle. The MAP is an important parameter to compute the air-fuel ratio provided to the engine. These sensors are surface micromachined with a monolithic integrated signal conditioning circuit implemented in BiCMOS technology. The MAP sensors convert a pressure signal into an analog output signal. These sensors feature high precision sensing, ratiometric analog output, broken wire detection, clamping, automotive qualification, and a large temperature range. Typical applications include automotive, industrial control, consumer, medical, weather stations, and altimeters.

Sensor Solutions

Infineon Technologies Sensor Solutions make life smarter, safer, and greener with a broad range of sensors for various applications in automotive, industrial, and home markets. Infineon sensors are exceptionally precise, thanks to industry-leading technologies. They are ideal for a wide range of applications in the automotive, industrial, and consumer markets. Sensors are the link and the enabling element in the interaction between people and devices. This interaction often depends on collecting, merging, and interpreting information from different sources. Infineon’s sensor solutions applications can rise to the next level of innovation and provide users with a smoother and more reliable interaction with technology.