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EMC2101-R-ACZL-TR

Name: Microchip EMC2101-R-ACZL-TR
Brand: Microchip Technology
SKU: 886-EMC2101RACZLTR
Price: 1.22 USD
Availability: InStock

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Mouser No:

886-EMC2101RACZLTR

Mfr. No:

EMC2101-R-ACZL-TR

Mfr.:

Microchip Technology

Description:

Board Mount Temperature Sensors Single Fan Controller

View in Development Tools Selector

Datasheet:

EMC2101-R-ACZL-TR Datasheet (PDF)

ECAD Model:

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In Stock: 3,999

Stock:: 3,999 Can Dispatch Immediately

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Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

$-.--

Est. Tariff:

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$1.22	$1.22
	$1.02	$25.50
	$0.93	$93.00
Full Reel (Order in multiples of 2500)
	$0.93	$2,325.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Microchip
Product Category:	Board Mount Temperature Sensors
RoHS:
Output Type:	Digital, Analog
Accuracy:	+/- 1 C
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Package/Case:	MSOP-8
Interface Type:	2-Wire, I2C, SMBus
Supply Voltage - Min:	3 V
Supply Voltage - Max:	3.6 V
Configuration:	Remote
Resolution:	11 bit
Shutdown:	No Shutdown
Mounting Style:	SMD/SMT
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Microchip Technology
Moisture Sensitive:	Yes
Operating Supply Current:	300 uA
Product:	Fan Controllers
Product Type:	Board Mount Temperature Sensor ICs
Factory Pack Quantity:	2500
Subcategory:	Sensors
Type:	Fan Controller

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Datasheet

EMC2101-R-ACZL-TR Datasheet (PDF)

DTS

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CNHTS:: 8542399000
CAHTS:: 8542310000
USHTS:: 8542310030
KRHTS:: 8542311000
TARIC:: 8542319000
MXHTS:: 8542399999
ECCN:: EAR99

Datacom

Microchip Technology Datacom is a comprehensive product portfolio for Data Center infrastructure that includes value-added data center solutions. These solutions include Power Management, Mixed-Signal, Security, Signal Integrity, Timing, FPGAs, MPUs, Co-Processors, and Management software. Microchip Technology is ready to help design, deploy, and manage any data center infrastructure equipment with solutions supporting high densities, low latency, flexibility, compatibility, and scalability.