170673-2278

Molex
538-170673-2278
170673-2278

Mfr.:

Description:
Standard Card Edge Connectors EDGELINE 278CKTS 0.062 PCB

ECAD Model:
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In Stock: 198

Stock:
198 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$39.78 $39.78
$38.43 $384.30
$36.03 $900.75
$34.31 $1,715.50
$33.49 $3,349.00

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Standard Card Edge Connectors
RoHS:  
278 Position
0.8 mm
Press Fit
Vertical
Gold
170673
Brand: Molex
Contact Material: Tin
Current Rating: 1.5 A
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Packaging: Tray
Product Type: Standard Card Edge Connectors
Factory Pack Quantity: 144
Subcategory: Card Edge Connectors
Tradename: EdgeLine
Voltage Rating: 250 VAC
Part # Aliases: 1706732278 1706732278
Unit Weight: 11.073 g
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Attributes selected: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

EdgeLine Connectors

Molex EdgeLine Low-Profile Connectors support up to 25Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions and high-density signal applications. The product line's one-piece solutions are cost-effective as they are only required when a peripheral interface or upgrade card is populated. EdgeLine includes a customizable card-edge interface to enable designers to specify first-mate, last-break designations as well as shorter stubs for high-speed communications. The Molex EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing, and storage applications.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.