55932-1310

Molex
538-55932-1310
55932-1310

Mfr.:

Description:
Headers & Wire Housings 2.0 WtB Plg Hsg Assy g Hsg Assy Str 13Ck

ECAD Model:
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In Stock: 10,075

Stock:
10,075 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$1.21 $1.21
$1.03 $10.30
$0.989 $24.73
$0.968 $48.40
$0.563 $45.04
$0.552 $309.12
$0.54 $561.60
$0.529 $1,354.24

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
13 Position
2 mm (0.079 in)
1 Row
Through Hole
Solder Pin
Straight
Pin (Male)
Tin
55932
MicroClasp
Wire-to-Board, Signal
- 25 C
+ 105 C
Tray
Brand: Molex
Contact Material: Tin
Current Rating: 3 A
Housing Colour: Natural
Housing Material: Polyester
Product Type: Headers & Wire Housings
Factory Pack Quantity: 80
Subcategory: Headers & Wire Housings
Voltage Rating: 250 V
Part # Aliases: 0559321310
Unit Weight: 1.139 g
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.

MicroClasp Wire-to-Board Connector System

Molex MicroClasp Wire-to-Board Connector System provides space savings and easy mating/unmating compared to similar 2.00 and 2.50mm pitch wire-to-board systems. MicroClasp includes a unique inner positive lock that provides latch protection, secure retention, and an audible mating "click". The terminal design offers low insertion and withdrawal forces and is able to carry 3.0A current in a compact 2.00mm pitch design. Molex MicroClasp system is available in 2-40 circuits in SMT and through-hole designs, and in single- and dual-row versions.