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75705-5604

Name: Molex 75705-5604
Brand: Molex
SKU: 538-75705-5604
Price: 29.8 USD
Availability: OutOfStock

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Mouser No:

538-75705-5604

Mfr. No:

75705-5604

Mfr.:

Molex

Description:

High Speed/Modular Connectors I-TRAC BP SIGNAL MOD ULE - 6 COL GD RIGHT

Datasheet:

75705-5604 Datasheet

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 12 Weeks Estimated factory production time.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$29.80	$29.80
	$25.33	$253.30
	$23.74	$593.50
	$22.61	$1,130.50
	$18.58	$1,337.76

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	132 Position
Number of Rows:	11 Row
Pitch:	1.85 mm
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	75705
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 80 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	72
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	120 VAC/DC
Part # Aliases:	0757055604
Unit Weight:	8.175 g

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Datasheet

75705-5604 Datasheet

Models

PCN

Product Change Notification 2025-4-7 (PDF)

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.