NVT2002TLH

NXP Semiconductors
771-NVT2002TLH
NVT2002TLH

Mfr.:

Description:
Translation - Voltage Levels Bidirectional voltage level translator for open-drain and push-pull applications

ECAD Model:
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In Stock: 5,471

Stock:
5,471 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$0.74 $0.74
$0.528 $5.28
$0.474 $11.85
$0.415 $41.50
$0.387 $96.75
$0.37 $185.00
$0.356 $356.00
Full Reel (Order in multiples of 4000)
$0.334 $1,336.00
$0.326 $2,608.00

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Translation - Voltage Levels
RoHS:  
Bidirectional Level Translator
Voltage Level Shifter
HXSON-8
5.5 V
1 V
NVT2002
1.5 ns
- 40 C
+ 105 C
SMD/SMT
Reel
Cut Tape
Brand: NXP Semiconductors
Number of Channels: 1 Channel
Output Type: Open Drain, Push-Pull
Product Type: Translation - Voltage Levels
Factory Pack Quantity: 4000
Subcategory: Logic ICs
Part # Aliases: 935291166125
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CAHTS:
8542390000
USHTS:
8542390090
TARIC:
8542399000
MXHTS:
8542399999
ECCN:
EAR99

NVT2006/08/10 Voltage-Level Translators

NXP Semiconductors NVT2006, NVT2008, and NVT2010 bidirectional voltage-level translators are operational from 1.0V to 3.6V and 1.8V to 5.5V, allowing bidirectional voltage translations between 1.0V and 5V without the need for a direction pin in open-drain or push-pull applications. Bit widths ranging from 6-bit (NVT2006), 8-bit (NVT2008), and 10-bit (NVT2010) are offered for level translation application with transmission speeds <33 MHz for an open-drain system with a 50pF capacitance and a pull-up of 197Ω. These NXP Semiconductors bidirectional voltage-level translators feature less 1.5ns maximum propagation delay. NXP NVT200x voltage-level translators provide excellent ESD protection to lower voltage devices while at the same time protecting less ESD-resistance devices.

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.