BALF-NRF01D3

STMicroelectronics
511-BALF-NRF01D3
BALF-NRF01D3

Mfr.:

Description:
Signal Conditioning 50 ohms nominal input / conjugate match balun to nRF51822-QFAAG0,\rnRF51822-QF

ECAD Model:
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In Stock: 4,731

Stock:
4,731 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 5000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
$0.32 $0.32
$0.293 $2.93
$0.274 $6.85
$0.266 $26.60
$0.256 $64.00
$0.243 $121.50
$0.229 $229.00
Full Reel (Order in multiples of 5000)
$0.197 $985.00
$0.18 $1,800.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: Signal Conditioning
RoHS:  
Signal Conditioning
Baluns
2.45 GHz
2400 MHz to 2540 MHz
50 Ohms
SMD/SMT
FlipChip-5
- 40 C
+ 85 C
BALF-NRF01D3
Reel
Cut Tape
MouseReel
Brand: STMicroelectronics
Insertion Loss: 1.35 dB
Mounting: Board Mount
Factory Pack Quantity: 5000
Subcategory: Filters
Type: Ultraminiature Balun
Unit Weight: 1.820 mg
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Attributes selected: 0

CNHTS:
8504319000
CAHTS:
8542390000
USHTS:
8542390090
JPHTS:
854239099
TARIC:
8542399000
MXHTS:
8542399901
ECCN:
EAR99

BALF-NRF01D3 Ultra Miniature Balun

STMicroelectronics BALF-NRF01D3 Ultra Miniature Balun integrates a matching network in a monolithic glass substrate. The matching impedance for this balun is customized for the nRF51822-QFAAG0/GC/FA, nRF51822-QFABB0, and nRF51422-QFAAE0 RF transceivers. The BALF-NRF01D3 balun uses STMicroelectronics Integrated Passive Device (IPD) technology on a non-conductive glass substrate that optimizes RF performances.

Balun Transformers

STMicroelectronics Balun Transformers use ST's process of integrating high-quality RF passive components on a single glass substrate. In addition to balanced/unbalanced conversion, these baluns can incorporate a matching network in a footprint smaller than 1mm2 for the complete function. The baluns are designed using STMicroelectronics Integrated Passive Device (IPD) technology on a non-conductive glass substrate to optimize RF performance. These baluns include companion chips to ST's transceivers, help significantly reduce RF complexity, and provide an optimized link budget. Balun transformers integrate three functions: impedance matching, 50Ω nominal impedance, and harmonic filter.