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EBTM-6-08-2.0-S-RA-1

Name: Samtec EBTM-6-08-2.0-S-RA-1
Brand: Samtec
SKU: 200-EBTM-60820S-RA1
Price: 28.19 USD
Availability: InStock

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Mouser No:

200-EBTM-60820S-RA1

Mfr. No:

EBTM-6-08-2.0-S-RA-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

EBTM-6-08-2.0-S-RA-1 Datasheet (PDF)

ECAD Model:

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In Stock: 40

Stock:: 40 Can Dispatch Immediately

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Factory Lead Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

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Est. Tariff:

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$28.19	$28.19
	$25.77	$257.70
	$21.52	$1,291.20
	$19.53	$1,953.00
	$17.96	$4,669.60
	$16.52	$8,260.00
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Product:	Headers
Number of Positions:	96 Position
Number of Rows:	8 Row
Pitch:	2 mm
Termination Style:	Through Hole
Series:	EBTM
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Orientation:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	20
Subcategory:	Backplane Connectors

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Datasheet

EBTM-6-08-2.0-S-RA-1 Datasheet (PDF)

Models

EBTM-6-08-2.0-S-RA-1 Symbol & Footprint by SnapMagic

Conflict Material Declaration (Spreadsheet)

USHTS:: 8536694040
ECCN:: EAR99

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.