HDTM-3-06-2-S-VT-5-R-3

Samtec
200-HDTM3062SVT5R3
HDTM-3-06-2-S-VT-5-R-3

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$10.60 $10.60
$9.56 $95.60
$8.52 $213.00
$6.95 $667.20
$6.25 $1,800.00
$5.77 $3,046.56
$5.17 $5,211.36
$4.58 $9,233.28

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
Tray
Brand: Samtec
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 48
Subcategory: Backplane Connectors
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Attributes selected: 0

USHTS:
8536694040

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.