BGM240PA22VNA3R

Silicon Labs
634-BGM240PA22VNA3R
BGM240PA22VNA3R

Mfr.:

Description:
Bluetooth Modules - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module

ECAD Model:
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In Stock: 2,872

Stock:
2,872
Can Dispatch Immediately
On Order:
2,000
Expected 10/04/2026
Factory Lead Time:
12
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$7.19 $7.19
$6.59 $65.90
$6.00 $150.00
$5.39 $539.00
$5.01 $1,252.50
$4.75 $2,375.00
Full Reel (Order in multiples of 1000)
$4.58 $4,580.00

Alternative Packaging

Mfr. Part No.:
Packaging:
Cut Tape
Availability:
In Stock
Price:
$6.98
Min:
1

Product Attribute Attribute Value Select Attribute
Silicon Labs
Product Category: Bluetooth Modules - 802.15.1
RoHS:  
BGM240P
Bluetooth v5.4
Class 2
GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART
10 dBm
2 Mb/s
2.4 GHz
1.8 V
3.8 V
- 40 C
+ 105 C
Reel
Cut Tape
Antenna: Integrated, Chip
Brand: Silicon Labs
Core: 32-bit ARM Cortex-M33
Dimensions: 12.9 mm x 15 mm
Memory Size: 1.5 MB Flash, 256 kB RAM
Modulation Technique: GFSK
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 1.8 V to 3.8 V
Product: Bluetooth Modules
Product Type: Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1: Bluetooth LE
Sensitivity: - 106.5 dBm
Factory Pack Quantity: 1000
Subcategory: Wireless & RF Modules
Supply Current Receiving: 4.5 mA
Supply Current Transmitting: 18.8 mA
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Attributes selected: 0

CNHTS:
8517629990
USHTS:
8517620090
JPHTS:
851762090
TARIC:
8517620000
ECCN:
5A992.C

BGM240P Modules

Silicon Labs BGM240P Modules are optimized for battery and line-powered IoT devices running on BLUETOOTH® networks. The modules are based on the Series 2 EFR32BG24 SoC. The modules enable Bluetooth® Low Energy connectivity, for exceptional RF performance, and energy efficiency. The BGM240P has Secure Vault® technology and future-proofing capabilities. The modules are a complete solution with robust and fully-upgradeable software stacks, global regulatory certifications, advanced development, and debugging tools.