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1MM-HU-D05-VS-00-F-TBP

Name: TE Connectivity 1MM-HU-D05-VS-00-F-TBP
Brand: TE Connectivity
SKU: 571-1MMHUD05VS00FTBP
Price: 2.58 USD
Availability: InStock

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Mouser No:

571-1MMHUD05VS00FTBP

Mfr. No:

1MM-HU-D05-VS-00-F-TBP

Mfr.:

TE Connectivity

Description:

Board to Board & Mezzanine Connectors SCL 1.0 HDR DRVT USP 010 SMT G1 TBK

Datasheet:

1MM-HU-D05-VS-00-F-TBP Datasheet

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Learn more about TE Connectivity 1MM-HU-D05-VS-00-F-TBP

In Stock: 1,523

Stock:: 1,523 Can Dispatch Immediately

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Factory Lead Time:: 6 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$2.58	$2.58
	$2.44	$61.00
	$2.38	$119.00
	$1.53	$143.82
	$1.47	$414.54
	$1.42	$800.88
	$1.39	$1,437.26

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Headers
Number of Positions:	10 Position
Pitch:	1 mm (0.039 in)
Number of Rows:	2 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	4.3 mm
Current Rating:	1 A
Voltage Rating:	30 VAC
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Packaging:	Tube
Brand:	TE Connectivity
Flammability Rating:	UL 94 V-0
Insulation Resistance:	500 MOhms, 1 GOhms
Mounting Style:	PCB
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	94
Subcategory:	Board to Board & Mezzanine Connectors
Part # Aliases:	2331928-5

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Datasheet

1MM-HU-D05-VS-00-F-TBP Datasheet

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CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.