1MM-R-D05-VS-00-H-TBP

TE Connectivity
571-1MMRD05VS00HTBP
1MM-R-D05-VS-00-H-TBP

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 010 SMT G3 TBK

Lifecycle:
Factory Special Order:
Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.
Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about TE Connectivity 1MM-R-D05-VS-00-H-TBP

In Stock: 491

Stock:
491 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 491 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$2.86 $2.86
$2.09 $196.46
$1.92 $541.44
564 Quote

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
10 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Brand: TE Connectivity
Flammability Rating: UL 94 V-0
Insulation Resistance: 500 MOhms, 1 GOhms
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 94
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 2267440-5
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

This functionality requires JavaScript to be enabled.

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.