TBD62183AFNG,EL

Toshiba
757-TBD62183AFNGEL
TBD62183AFNG,EL

Mfr.:

Description:
Gate Drivers DMOS Transistor Array 8-CH 50V 0.05A

ECAD Model:
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In Stock: 4,692

Stock:
4,692 Can Dispatch Immediately
Factory Lead Time:
22 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
$2.70 $2.70
$1.75 $17.50
$1.71 $42.75
$1.20 $120.00
$0.972 $486.00
$0.958 $958.00
Full Reel (Order in multiples of 2000)
$0.802 $1,604.00
$0.794 $3,176.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Toshiba
Product Category: Gate Drivers
RoHS:  
Driver ICs - Various
Low-Side
SMD/SMT
SSOP-18
8 Driver
8 Output
50 mA
2.8 V
25 V
Inverting
- 40 C
+ 85 C
Reel
Cut Tape
MouseReel
Brand: Toshiba
Logic Type: CMOS
Maximum Turn-Off Delay Time: 0.4 us
Maximum Turn-On Delay Time: 0.2 us
Output Voltage: 50 V
Pd - Power Dissipation: 960 mW
Product Type: Gate Drivers
Shutdown: No Shutdown
Factory Pack Quantity: 2000
Subcategory: PMIC - Power Management ICs
Technology: Si
Unit Weight: 90 mg
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Attributes selected: 0

CNHTS:
8542399000
CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
854129000
TARIC:
8541290000
MXHTS:
8541299900
ECCN:
EAR99

TBD62x DMOS FET Transistor Arrays

Toshiba TBD62x DMOS FET Transistor Arrays are equipped with 7-channel and 8-channel common source power DMOS arrays. The Doubled-Diffused MOSFET (DMOS FET) type sink-output driver allows high voltage and consumes less power due to reduced on-resistance of the output stage. These TBD62x transistor arrays feature 50V high output voltage, -0.5A high output current, and high efficiency. The transistor arrays operate from a -40°C to +85°C temperature range and support a -55°C to +150°C storage temperature range. These TBD62x transistor arrays are available in through-hole and surface-mount packages.