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TBD62384APG

Name: Toshiba TBD62384APG
Brand: Toshiba
SKU: 757-TBD62384APGHZ
Price: 3.99 USD
Availability: InStock

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Mouser No:

757-TBD62384APGHZ

Mfr. No:

TBD62384APG

Mfr.:

Toshiba

Description:

Gate Drivers DMOS Transistor Array 8-CH 50V 0.5A

Datasheet:

TBD62384APG Datasheet (PDF)

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Learn more about Toshiba TBD62384APG

In Stock: 385

Stock:: 385 Can Dispatch Immediately

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Factory Lead Time:: 34 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$3.99	$3.99
	$2.63	$26.30
	$2.58	$64.50
	$1.85	$185.00
	$1.45	$725.00
	$1.40	$1,120.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Toshiba
Product Category:	Gate Drivers
RoHS:
Product:	Driver ICs - Various
Type:	Low-Side
Mounting Style:	Through Hole
Package/Case:	PDIP-18
Number of Drivers:	8 Driver
Number of Outputs:	8 Output
Output Current:	500 mA
Supply Voltage - Min:	4.5 V
Supply Voltage - Max:	5.5 V
Configuration:	Inverting
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Toshiba
Output Voltage:	50 V
Pd - Power Dissipation:	1.47 W
Product Type:	Gate Drivers
Factory Pack Quantity:	800
Subcategory:	PMIC - Power Management ICs
Technology:	Si
Unit Weight:	1.300 g

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Datasheet

TBD62384APG Datasheet (PDF)

Application Notes

Test/Quality Data

Reliability Data

CNHTS:: 8542399000
CAHTS:: 8542390000
USHTS:: 8542390090
MXHTS:: 8542399999
ECCN:: EAR99

TBD62x DMOS FET Transistor Arrays

Toshiba TBD62x DMOS FET Transistor Arrays are equipped with 7-channel and 8-channel common source power DMOS arrays. The Doubled-Diffused MOSFET (DMOS FET) type sink-output driver allows high voltage and consumes less power due to reduced on-resistance of the output stage. These TBD62x transistor arrays feature 50V high output voltage, -0.5A high output current, and high efficiency. The transistor arrays operate from a -40°C to +85°C temperature range and support a -55°C to +150°C storage temperature range. These TBD62x transistor arrays are available in through-hole and surface-mount packages.