W25M512JVEIQ

Winbond
454-W25M512JVEIQ
W25M512JVEIQ

Mfr.:

Description:
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector

Lifecycle:
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Datasheet:
ECAD Model:
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In Stock: 5

Stock:
5 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 5 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 5
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$7.16 $7.16

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: Multichip Packages
RoHS:  
Serial NOR Flash
512 Mbit
WSON-8
W25M512JV
SMD/SMT
104 MHz
- 40 C
+ 85 C
Brand: Winbond
Data Bus Width: 8 bit
Interface Type: SPI
Moisture Sensitive: Yes
Organisation: 64 M x 8
Packaging: Tube
Product Type: Multichip Packages
Factory Pack Quantity: 63
Subcategory: Memory & Data Storage
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 2.7 V
Tradename: SpiStack
Unit Weight: 2.265 g
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Attributes selected: 0

CNHTS:
8542329090
CAHTS:
8542320040
USHTS:
8542320051
MXHTS:
8542320299
ECCN:
3A991.b.1.a

Serial MCP Flash Portfolio with SpiStack®

Winbond Serial MCP Flash Portfolio with SpiStack® is based on the W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV. The portfolio offers flexible memory density and reliability combinations for the low pin count package and Concurrent Operations in Serial Flash memory for the first time. Winbond W25M SpiStack series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. The series comprises a 1.8V NAND Flash Memory device and a 1.8V Low Power SDRAM device. MCP is an all-in-one package that provides an effective solution for saving Printed Circuit Board (PCB) space. This benefit becomes more critical in small PCBs for modules and space-critical designs, particularly for mobile and portable applications.

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