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TD120N16SOF

Name: Infineon TD120N16SOF
Brand: Infineon Technologies
SKU: 641-TD120N16SOF
Price: 33.45 USD
Availability: OutOfStock

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Mouser No:

641-TD120N16SOF

Mfr. No:

TD120N16SOF

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules 20mm Solder Bond Thyristor/Diode

Datasheet:

TD120N16SOF Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Infineon Technologies TD120N16SOF

Availability

Stock:: 0

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Factory Lead Time:: 30 Weeks Estimated factory production time.

Long lead time reported on this product.

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Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$33.45	$33.45
	$28.53	$342.36
	$24.95	$2,694.60

Alternative Packaging

Mfr. Part No.:

TD120N16SOFHPSA1

Packaging:

Tray

Availability:

In Stock

Price:

$32.13

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Product:	Thyristor-Diode Modules
Type:	Thyristor / Diode
Technology:	Si
Mounting Style:	Screw Mount
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Gate Trigger Current - Igt:	100 mA
Holding Current Ih Max:	250 mA
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	12
Subcategory:	Discrete and Power Modules
Part # Aliases:	SP001272854 TD120N16SOFHPSA1
Unit Weight:	75 g

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Datasheet

TD120N16SOF Datasheet (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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CNHTS:: 8504901900
CAHTS:: 8541100090
USHTS:: 8541300080
JPHTS:: 854110090
KRHTS:: 8541109000
TARIC:: 8541100000
MXHTS:: 8541100101
ECCN:: EAR99

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.