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TGP 1000VOUS Ultra Conformable GAP PAD®
Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.