08EP08-N3GTC32-GA67

Kingston
524-N3GTC32-GA67
08EP08-N3GTC32-GA67

Mfr.:

Description:
Multichip Packages 8GB+8Gb 136 ball ePoP

Datasheet:
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Learn more about Kingston 08EP08-N3GTC32-GA67

In Stock: 32

Stock:
32 Can Dispatch Immediately
Factory Lead Time:
5 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$33.75 $33.75
$31.24 $312.40
$30.24 $907.20
$29.50 $1,770.00
$28.76 $3,019.80

Product Attribute Attribute Value Select Attribute
Kingston
Product Category: Multichip Packages
RoHS:  
8 Gbit, 8 Gbit
FBGA-136
SMD/SMT
- 25 C
+ 85 C
Brand: Kingston
Interface Type: eMMC 5.1
Moisture Sensitive: Yes
Packaging: Tray
Product Type: Multichip Packages
Factory Pack Quantity: 15
Subcategory: Memory & Data Storage
Unit Weight: 162 mg
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Attributes selected: 0

Datasheet

CNHTS:
8542329090
CAHTS:
8542320040
USHTS:
8542320051
MXHTS:
8542320299
ECCN:
EAR99

Embedded Flash

Kingston Technology Embedded Flash is an embedded, non-volatile memory system consisting of both Flash memory and a Flash memory controller. The Embedded Flash products simplify the application interface design and frees the host processor from low-level Flash memory management. The modules are ideal for industrial and embedded applications, including consumer electronics. Kingston Technology Embedded Flash offers a quick interface design and qualification process, reducing time to market and supporting future Flash device offerings. The I-Temp Flash memory provides JEDEC eMMC5.1 features and is backward compatible with earlier eMMC standards. It has all the benefits of standard Flash, plus the operating temperature range meets industrial temperature requirements of -40°C to +85°C, ideal for outdoor surveillance, factory automation, transportation, and other applications in fluid environmental conditions.

ePOP & eMCP Multi-Chip Package Memory Devices

Kingston ePOP and eMCP Multi-Chip Package Memory Devices combine e.MMC™storage (JESD84-B51) and low power DDR4X(JESD209-4-1)/DDR3 (JESD209-3B) Synchronous Dynamic RAM. The e.MMC™ part is an embedded flash memory storage solution with an e.MMC™ interface. The e.MMC™ controller directly manages NAND flash, including wear-leveling, end-to-end error control, IOPS optimization, and read sensing. These devices are available in an 8mm x 9.5mm or 10mm x 10mm package. The ePOP and eMCP devices are used in mobile communications applications.

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