ML3219D-MERCURY-M0-PA11

Telink
141-ML3219DMERCM0PE1
ML3219D-MERCURY-M0-PA11

Mfr.:

Description:
Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Telink ML3219D-MERCURY-M0-PA11

In Stock: 2

Stock:
2 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$6.69 $6.69
$6.13 $61.30
$5.58 $139.50
$5.02 $502.00
$4.69 $1,172.50
$4.45 $2,225.00
$4.28 $4,280.00

Product Attribute Attribute Value Select Attribute
Telink
Product Category: Multiprotocol Modules
RoHS:  
ML3
2.4 GHz to 2.483 GHz
8.4 dBm
I2C, SPI, UART
1.8 V
4.3 V
- 40 C
+ 125 C
26 mm x 11.3 mm x 2.6 mm
Zigbee
Reel
Brand: Telink
Core: RISC-V
Data Rate: 2 Mb/s
Memory Size: 128 kB
Moisture Sensitive: Yes
Number of Channels: 6 Channel
Operating Supply Voltage: 3.3 V
Product: Wireless Modules
Product Type: Multiprotocol Modules
Sensitivity: - 96 dBm
Factory Pack Quantity: 1
Subcategory: Wireless & RF Modules
Supply Current Receiving: 8 mA
Supply Current Transmitting: 9.2 mA
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Attributes selected: 0

Datasheet

Compliance Codes
CNHTS:
8517629990
USHTS:
8517620090
JPHTS:
851762090
TARIC:
8517620000
ECCN:
5A992.C
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

ML3219D Multi-Standard Wireless Module

Telink ML3219D Multi-Standard Wireless Module seamlessly connects to various IoT ecosystems, supporting multiple standards, including BLUETOOTH® Low Energy, Zigbee® RF4CE, Matter, Thread, and 2.4GHz proprietary protocols. The ML3219D features rich interfaces, low power consumption, and several security mechanisms, such as Secure Boot, encryption and verification, OTA updates, and secure debugging. The module offers a 32-bit RISC-V MCU with DSP extension capabilities for data processing. Memory includes 128KB of SRAM (including 96KB of retained SRAM) and 2MB of embedded flash, providing strong support for program execution and data storage. Telink ML3219D Multi-Standard Wireless Module is ideal for smart homes, remote control, wireless human interface devices (HID), wearables, and asset tracking applications.

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