Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Results: 85
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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Package/Case
Material
Thermal Conductivity
Breakdown Voltage
Color
Minimum Operating Temperature
Maximum Operating Temperature
Length
Width
Thickness
Tensile Strength
Flammability Rating
Series
Packaging
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 180ml Cartridge, 6 W/m-K, Liqui-Form
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 10
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material TLF 6000HG
Bergquist Company Thermal Interface Products
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company Thermal Interface Products GAP PAD, 6W/m-K, 8" x 16" Sheet, 0.125" Thickness, TGP6000ULM, IDH 2214846
Datasheet
Lead-Time 8 Weeks

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 6 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm 3.175 mm 6 psi UL 94 V-0 TGP 6000ULM
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 833,334
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2,871
Mult.: 1

TLF 6000HG
Bergquist Company 2763096
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable, 6.0 W/m-K, Liqui-Form TLF 6000HG
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K
Datasheet
Non-Stocked Lead-Time 15 Weeks
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM