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Qty. RoHS ECAD Model Product
Number of Positions
Pitch
Number of Rows
Termination Style
Mounting Angle
Current Rating
Minimum Operating Temperature
Maximum Operating Temperature
Contact Plating
Contact Material
Housing Material
TE Connectivity Board to Board & Mezzanine Connectors SAS/PCIE 4.0 U.2/U.3 RCPT 68P
Datasheet
700In Stock
Min.: 1
Mult.: 1

Receptacles 68 Position 1.27 mm (0.05 in) 2 Row Solder 500 mA 0 C + 55 C Gold Copper Alloy Liquid Crystal Polymer (LCP)


TE Connectivity Board to Board & Mezzanine Connectors SAS/PCIE 4.0 U.2/U.3 RCPT 68P
Datasheet
707In Stock
Min.: 1
Mult.: 1

Connectors 68 Position 1.27 mm (0.05 in) 2 Row Solder Vertical 500 mA 0 C + 55 C Gold Copper Alloy Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors SAS/PCIE 4.0 U.2/U.3 RCPT 68P
Datasheet
379In Stock
Min.: 1
Mult.: 1

Receptacles 68 Position 1.27 mm (0.05 in) 2 Row Solder 500 mA 0 C + 55 C Gold Copper Alloy Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors SAS/PCIE 4.0 U.2/U.3 RCPT 68P
Datasheet
788In Stock
Min.: 1
Mult.: 1

Connectors 68 Position 1.27 mm (0.05 in) 2 Row Solder Vertical 500 mA 0 C + 55 C Gold Copper Alloy Liquid Crystal Polymer (LCP)