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COM-HPC® Computer-on-Module
congatec COM-HPC® Computer-on-Module is used for high-performance computing that supports fast I/O like PCIe Gen5, and USB4 25G Ethernet. More I/O interfaces include 64x PCIe and 8x 25G Ethernet. The COM-HPC features more DRAM, with up to 1TB (8x full-size DIMM) and server CPU performance up to 300W power consumption for a Server-On-Module. The COM-HPC standard is hosted by the PCI Industrial Computer Manufacturing Group (PICMG) and is supported by up to now 29 companies.