GNSS Mobile Modules

Results: 52
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Supply Current Transmitting Supply Current Receiving Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Cellular, NBIoT, LTE Packaging
Telit Cinterion Mobile Modules EMS31-US Rel.3 Non-Stocked
Min.: 500
Mult.: 500
: 1,000
1.9 GHz UART, USB 3.2 V 4.5 V LTE Reel, Cut Tape
Telit Cinterion Mobile Modules EMS31-X Rel.3.1 Non-Stocked
Min.: 500
Mult.: 500
: 1,000
1.9 GHz UART, USB 3.2 V 4.5 V LTE Reel, Cut Tape
Telit Cinterion Mobile Modules LN920A6-NA M.2 40.00.002 Non-Stocked
Min.: 90
Mult.: 90
USB 3.1 V 3.6 V - 40 C + 85 C RF 30 mm x 42 mm x 2.4 mm Cellular Tray
Quectel Mobile Modules IoT/M2M-optimized LTE Cat 1 Modules Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

UART, USB, PCM, I2C, Netlight, SPI 3.3 V 4.3 V - 35 C + 75 C LTE, Cat-M1
Quectel Mobile Modules External, 600-6000, 5G, Dipole, -, SMA Male (center pin) , Terminal, 221 26.95 13.5 Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 22 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 690-960, 1710-2690 , LTE (4G), Monopole, 1500 +/-30, SMA Male (center pin) , Magnetic, 112 29.8 Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 18 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 700-2700, 3300-5000 , 5G, Dipole, 1500, SMA Male (center pin) , Magnetic, 234 F 60, 1.5 DS Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100
: 100

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 34 mA 34 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Non-Stocked
Min.: 1
Mult.: 1

800 MHz, 1.9 GHz I2C, PCM, UART, USB, USIM 3.8 V 3.8 V 3.7 mA - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE
Quectel Mobile Modules Non-Stocked
Min.: 1
Mult.: 1

800 MHz, 1.8 GHz I2C, PCM, UART, USB, USIM 3.8 V 3.8 V 3.7 mA - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE
Quectel Mobile Modules Non-Stocked
Min.: 1
Mult.: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz I2C, PCM, UART, USB, USIM 3.8 V 3.8 V 3.7 mA - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE
Quectel Mobile Modules CAT 1

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1 + 3G + 2G module Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules CAT 1 Non-Stocked
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Latin A, Australia, NZ Non-Stocked Lead-Time 14 Weeks
Min.: 250
Mult.: 250
: 250

EC/EG21 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, Latin A, Australia, NZ Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Non-Stocked
Min.: 250
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 17 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 698-2700, LTE (4G), Dipole, 1000 +/-30, SMA Male (center pin) , Adhesive, 152 18 5.9 Non-Stocked
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 17 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Support B28A, EMEA Non-Stocked Lead-Time 14 Weeks
Min.: 250
Mult.: 250
: 250

EC/EG21 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, EMEA Non-Stocked Lead-Time 14 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1, 4Gbit ROM+2Gbit RAM, South Korea only Non-Stocked Lead-Time 18 Weeks
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1, mPCIe form factor, South Korea Non-Stocked Lead-Time 26 Weeks
Min.: 100
Mult.: 100
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V 32 mA - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Reel
Quectel Mobile Modules CAT 1 Non-Stocked
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1, 4Gbit ROM+2Gbit RAM, Verizon (NA) Non-Stocked Lead-Time 14 Weeks
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 250

UART, USB, PCM, I2C, Netlight, SPI 3.3 V 4.3 V - 35 C + 75 C LTE, Cat-M1 Reel, Cut Tape