3.3 V Mobile Modules

Results: 5
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Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Supply Current Transmitting
Supply Current Receiving
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Cellular, NBIoT, LTE
Packaging
IEI Mobile Modules Mini-ITX SBC with Socket G1 for Intel mobile Core i7/i5/i3 and Celeron CPU,VGA/DVI/LVDS/HDMI,Dual PCIe GbE,USB 2.0,Dual PCIe Mini,SATA II and Audio,RoHS
Datasheet
2In Stock
Min.: 1
Mult.: 1
Max.: 2

900 MHz, 1.8 GHz, 2.1 GHz 33 dBm PCI, USB 3.3 V 3.3 V - 30 C + 85 C External 50.95 mm x 30 mm x 4.75 mm Cellular
Quectel Mobile Modules Cat 4 + 3G + 2G, 2Gbit ROM+2Gbit RAM, voice + data, Global
Datasheet
988On Order
Min.: 1
Mult.: 1
: 250

33 dBm I2C, UART, USB 3.3 V 3.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm Reel, Cut Tape
u-blox Mobile Modules LTE/HSPA+/GSM module for Softbank (JP) Cat 4, B1, B3, B5, B7, B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

1.9 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE Cat 4 only; Japan/NTT docomo LTE: 1,3,5,8,19 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE
u-blox Mobile Modules LTE/HSPA+/GSM module LTE:B1,B3,B5,B7,B8,B28; 3G :B1,B2,B5,B8 PCIe card, 51x30 mm, MOQ 160pcs, on tray
Datasheet
Non-Stocked
Min.: 160
Mult.: 160

2.1 GHz 23 dBm GPIO, I2C, UART, USB 3.3 V 3.3 V 880 mA 880 mA - 20 C + 65 C 51 mm x 30 mm x 3.7 mm 2G/3G, LTE