All Results (656)

Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mPTL. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM COM Express Type 6 Basic module with Skylake-H Intel Core i3-6102E quad core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface.

Computer-On-Modules - COM COM-HPC Client module based on Intel Core i9-14900 LGA 1700 processor with 8 P-cores 2.0GHz up to 5.4GHz Turbo and 16 E-cores 1.5GHz up to 4.3GHz Turbo 36MB Intel Smart Cache Intel UHD Graphics 770 with 32EUs Dual channel DDR5 memory interf

congatec COM-HPC Client module based on Intel Core 7 Processor 253PE with 10 P-cores 2.5GHz up to 5.5GHz Turbo 33MB Intel Smart Cache 32EUs Dual channel DDR5 memory interface Chipset R680E Intel code name: Bartlett Lake S

Heat Sinks Standard heatspreader for high performance COM Express module conga-MC1000 with H484. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for high performance COM Express module conga-MC1000 with H404. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM COM Express Type 7 Basic module based on Intel Xeon D-1848TER 10-core processor with 2.0GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-DLCC). Industrial temperature range

Computer-On-Modules - COM SMARC Module with NXP i.MX 9594 4-core processor. Features 4x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8840U with 8 cores 3.3GHz up to 5.1GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial tempe

congatec COM Express Type 6 Compact module based on AMD Ryzen Embedded 8640U with 6 cores 3.2GHz up to 4.9GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 22MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temperature ra

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.