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Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 2MB PSRAM in IC package, 8MB Flash in module
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 1
Mult.: 1
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs Multiprotocol Modules SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 4MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs Multiprotocol Modules SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
NXP Semiconductors Multiprotocol Modules AW693PHNB/A1ZDB Non-Stocked Lead-Time 16 Weeks
Min.: 840
Mult.: 840

2.4 GHz, 5 GHz to 7 GHz UART 11 mm x 11 mm x 0.85 mm Bluetooth 5.3 Wi-Fi 6/6E Tray
NXP Semiconductors Multiprotocol Modules IW610BHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,700
Mult.: 2,700
: 2,700

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors Multiprotocol Modules IW610CHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,700
Mult.: 2,700
: 2,700

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors Multiprotocol Modules IW610FHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW610GHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 2,700

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW611HN/A1C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel
NXP Semiconductors Multiprotocol Modules IW612HN/A1C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
NXP Semiconductors Multiprotocol Modules IW612HN/A1C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel
NXP Semiconductors Multiprotocol Modules IW612HN/A1I
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1,300
Mult.: 1,300

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Tray
Digi Multiprotocol Modules ConnectPort X2 ZigBee/Wi-Fi 802.11b Non-Stocked
Min.: 1
Mult.: 1

SMA 12 V 12 V - 30 C + 70 C RP-SMA 802.15.4 (ANT, Thread, Zigbee)
Digi Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, AT&T SIM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 25
Mult.: 25

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, Verizon SIM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 25
Mult.: 25

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, AT&T SIM
Datasheet
25Expected 02/02/2027
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Multiprotocol Modules Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, Verizon SIM
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Olimex Ltd. Multiprotocol Modules ESP32-WROOM-32 WIFI/BLE module Non-Stocked
Min.: 1
Mult.: 1

2 W - 40 C + 85 C U.FL 98 mm x 28 mm
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
Datasheet
Non-Stocked
Min.: 1
Mult.: 1
RS9116 2.4 GHz, 5 GHz 20 dBm Serial 3 V 3.63 V - 40 C + 85 C u.FL 15 mm x 15.7 mm x 2.2 mm Bluetooth 5.0 802.11 a/b/g/n
Silicon Labs Multiprotocol Modules EFR32MG13 Mesh SiP Module, 2.4GHz, 512kB Flash, +10 dBm
Datasheet
Non-Stocked
Min.: 260
Mult.: 260

MGM13S 2.4 GHz Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec
Datasheet
Non-Stocked
Min.: 260
Mult.: 260

MGM13S 2.4 GHz Tray
Silicon Labs Multiprotocol Modules
Datasheet
Non-Stocked
Min.: 588
Mult.: 1
2.4 GHz, 5 GHz 17 dBm SPI, UART, USB 3 V 3.6 V - 40 C + 85 C 14 mm x 15 mm x 2.1 mm 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee)
Silicon Labs Multiprotocol Modules
Datasheet
Non-Stocked
Min.: 588
Mult.: 1
2.4 GHz, 5 GHz 17 dBm SPI, UART, USB 3 V 3.6 V - 40 C + 85 C 14 mm x 15 mm x 2.1 mm 802.11 a/b/g/n 802.15.4 (ANT, Thread, Zigbee)