Tray Smart Card Interface ICs

Results: 31
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 Mfr.
Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Type
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Operating Supply Current
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package/Case
Series
Packaging
NXP Semiconductors MF1S7001XDUD/V1V
NXP Semiconductors Smart Card Interface ICs MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 325,000
Mult.: 325,000

- 25 C + 70 C SMD/SMT Die MF1S70xx Tray
NXP Semiconductors MF1S7001XDUF/V1V
NXP Semiconductors Smart Card Interface ICs MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 325,000
Mult.: 325,000

- 25 C + 70 C SMD/SMT Die MF1S70xx Tray
NXP Semiconductors MF1S7031XDUD/V1V
NXP Semiconductors Smart Card Interface ICs MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 325,000
Mult.: 325,000

- 25 C + 70 C SMD/SMT Die MF1S70xx Tray
NXP Semiconductors MF1S7031XDUF/V1V
NXP Semiconductors Smart Card Interface ICs MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 325,000
Mult.: 325,000

- 25 C + 70 C SMD/SMT Die MF1S70xx Tray
NXP Semiconductors MF1SEP1001DUD/03V
NXP Semiconductors Smart Card Interface ICs Secure contactless smart card IC for seamless migration
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 473,400
Mult.: 473,400

- 25 C + 70 C Die Tray
NXP Semiconductors MF1SEP1031DUD/03V
NXP Semiconductors Smart Card Interface ICs Secure contactless smart card IC for seamless migration
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 18,936
Mult.: 18,936

- 25 C + 70 C Die Tray