Advanced Thermal Solutions ATS-VC Aluminum Vapor Chambers
Advanced Thermal Solutions ATS-VC Aluminum Vapor Chambers are vacuum-sealed heat spreaders with a wick structure lining the inside walls. These unique cooling solutions are used in high-power density or total power applications where a traditional heat sink becomes conduction-limited. The ATS-VC vapor chambers quickly spread heat in multiple directions and allow for cooling to get close to the heat source. These vapor chambers are available in 25mm x 25mm to 250mm x 250mm dimensions and less than 6mm in thickness. The ATS-VC vapor chambers feature mesh or groove wick type and Acetone as the working fluid. These vapor chambers include no moving parts and require no external parts. The ATS-VC vapor chambers are ideal for graphic card cooling, PCs, LED cooling, mobile devices, Solid State Disk Drive (SSD) cooling, and servers.
Features
- 25mm x 25mm to 250mm x 250mm dimensions and less than 6mm in thickness
- Mesh or groove wick type
- Acetone working fluid
- Up to 60°C maximum temperature
- Capillary and phase change create the forces required for fluid motion
- No power supply, controller, or valves needed to control the fluid flow
Applications
- Hard Disk Drive (HDD) and Solid State Disk Drive (SSD) cooling
- PCs (office, gaming, and overclocking)
- Industrial laser CNC
- High heat flux chips (IGBT and MOSFET)
- Industrial laser welding
- Graphic card cooling
- LED cooling
- Servers
- Mobile devices
Vapor Chambers
Vapor Chamber Schematics
Vapor Space Effective Thermal Conductivity as Function of Temperature
Schematic of a) Heat Pipe & b) Vapor Chamber with c) Vapor Chambers
Heat Sink Schematic View with (a) Solid Base & (b) Vapor Chamber Base
Heat Temperature Distribution
