Ka-Ro Electronics QFN Style Solder-Down Computer On Module

Ka-Ro Electronics QFN Style Solder-Down Computer On Module (COM) is single-sided, assembled in a small square size of 27mm and a height of 2.6mm. This module features a QFN-type lead style with a 1mm pitch and 100 pads. The QFN-style solder-down module is industrial-grade and features an RGB display interface, 2x USB connectivity, and an Arm^® Cortex^®-A55 1.4GHz NXP i.MX 91 processor. The Ka-Ro Electronics QS91 series is ideal for industrial, IoT, and medical applications.

Features

27mm square
2.6mm total height
QS family pin-compatible
Solder-down version
QFN type lead style:
- 1mm pitch
- 100 pads
- Thermal pad

Industrial grade
4GB eMMC ROM
Visual solder joint inspection is possible after soldering
Single-sided assembly
3.3V power supply

Applications

Industrial requirements
Medical
IoT

Specifications

Connectivity
- 2x USB 2.0
- Ethernet, RGMII
- 1x eMMC/SD
- 2x FlexCAN
- 8x UART, 7x I²C, 8x SPI, PWM, SAI, and 2x FLEXIO
- ADC (4-channel, 12-bit), tamper detection
- Up to 60x 3.3V general-purpose I/O