Quectel FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Module
Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Module is a high-performance module in an LGA package and supports the IEEE 802.11ax standard protocol. This module operates at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X module is designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the module to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X module is available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. This module operates over a wide temperature range of -40°C to 85°C and is available in an LGA package. The FGA66X module is ideal for a variety of smart home and industrial applications.
Features
- 2.4GHz/5GHz Wi-Fi bands, BLE 5.4, and 802.15.4 standard
- SDIO 3.0/ USB 2.0 interface that supports a higher data transmission rate and enables lower power consumption
- Faster time-to-market with a simple design minimizes design-in time and development efforts
- Multiple interfaces
- -40°C to 85°C wide operating temperature range
- 4th generation RF coaxial connector, PCB antenna (optional)
- Ultra-compact size
- LGA package
Applications
- Smart home
- Industrial
Specifications
- IEEE 802.11 a/b/g/n/ac/ax WLAN protocol
- 1 x 1 Wi-Fi antenna
- WPA2/WPA3 encryption mode
- AP/STA Wi-Fi operating mode
- VBAT_3V3: 3.14V to 3.46V, typical 3.3V power supply voltage
- Power consumption (maximum current at Tx mode):
- TBD @ 3.3V
- TBD @ 1.8V
- 23mm x 14mm x 2.2mm dimensions
Dimensions
