Wakefield Thermal omniKlip™ Heat Sinks for TO Packages
Wakefield Thermal omniKlip™ Heat Sinks with Clips are a configurable, high-performance, cost-effective, and compact solution for TO-220, TO-247, TO-264, and similar packages. The powerful heat sink provides a tool and fixture-free assembly operation, large surface areas, and small space occupation. Spring clips make the mounting holes and fasteners unnecessary while reducing costs and assembly time. Wakefield Thermal omniKlip Heat Sinks are ideal for applications requiring high power density and small size (1U or 2U) with forced convection cooling.
Features
- For TO-220, TO-247, TO-264, and similar packages
- Maximum flexibility for dynamic device locations and power upgrading
- Spring clips make mounting holes, fasteners, tools, and fixtures obsolete in assembly operations
- Constant spring force over repeated assembly/disassembly
- Resilient spring action locks electronic components into place
- Prevents short circuits by eliminating metal particles generated from hardware or thread-tapping
- Configurable, high-performance, cost-effective, and compact solution
Application Example
Universal Clip Mechanism
Videos
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