DA14531 Series RF System on a Chip - SoC

Results: 4
Select Image Part # Mfr. Description Datasheet Availability Pricing (USD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Core Operating Frequency Maximum Data Rate Output Power Sensitivity Supply Voltage - Min Supply Voltage - Max Supply Current Receiving Supply Current Transmitting Program Memory Size Minimum Operating Temperature Maximum Operating Temperature Package/Case Packaging
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package 15,858In Stock
Min.: 1
Mult.: 1
Reel: 4,000

Bluetooth ARM Cortex M0+ 2.4 GHz 2.5 dBm - 94 dBm 1.1 V 3.3 V 2.2 mA 3.5 mA 32 kB, 144 kB - 40 C + 85 C FCGQFN-24 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package 6,779In Stock
Min.: 1
Mult.: 1
Reel: 4,000

Bluetooth ARM Cortex M0+ 2.4 GHz 2.5 dBm - 94 dBm 1.1 V 3.3 V 2.2 mA 3.5 mA 32 kB, 144 kB - 40 C + 85 C WLCSP-17 Reel, Cut Tape
Renesas / Dialog DA14531-01000FX2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package Non-Stocked Lead-Time 18 Weeks
Min.: 4,000
Mult.: 4,000
Reel: 4,000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C FCGQFN-24 Reel
Renesas / Dialog DA14531-01000OG2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package Non-Stocked Lead-Time 18 Weeks
Min.: 4,000
Mult.: 4,000
Reel: 4,000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C WLCSP-17 Reel