Laird Featured Products

2-part, ceramic-filled gap fillers with a 1:1 mix ratio and a thermal conductivity of 9.2W/mK.

Supports higher operating temperatures (+200°C), especially for SiC and GaN power semiconductors.

Innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio.

Power line noise suppression and desired power efficiency while delivering extremely low DCR.

Thermal interface material with >6W/mK thermal conductivity with high recovery properties.

Transfers unwanted heat in automotive components and the A+B putty material cures in place.

Minimizes stress on components during assembly, offers the reliability of a traditional thermal pad.

Highly thermally conductive, specially designed in response to growing need for high-speed assembly.

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